Job Responsibilities:

1. Rf module design, including THE r&d of 2G, WCDMA, LTE, LTE+, 5G C-Band and other terminal RF module products;

2. Rf power amplifier chip design, mainly including gallium arsenide HBT, gallium nitride and other chip design.

Job Requirements:

1. 25-45 years old, male or female;

2. Bachelor degree or above, major in electronic engineering, microwave radio frequency;

3. Solid rf foundation, familiar with RF matching design and RF filter design;

4. Experience in electromagnetic simulation and active circuit design is preferred, such as rf power amplifier, low noise amplifier, etc.

5. Familiar with ADS, Cadence PCB and other design software;

6. Familiar with RF test equipment, such as signal source, spectrum analyzer, network analyzer, etc.;

7. Careful, responsible, with strong professional dedication;

8. Team player and able to work under pressure.

9. Good English reading and writing skills.

Benefits:

Five social insurance and one housing fund and supplementary commercial insurance

Generous year-end bonus and project award

Paid annual leave and paid sick leave

The opportunity to adjust salary every year

Job Responsibilities:

1. Evaluate the feasibility of packaging, and provide competitive packaging solutions for product design;

2. Optimized die Pad design and Ball Map design from the perspective of package design;

3. Completed package design, including substrate, POD, etc.;

4. Communicated with packaging and substrate factories and completed DFM;

5. Optimize the process flow from the perspective of packaging design, improve yield and reliability, and save costs;

6. Responsible for the preparation, maintenance and review of packaging information in product specifications;

Job Requirements:

1. Major in microelectronics, electromagnetic field and microwave, circuit and system, integrated circuit, etc.

2. Proficient in using layout tools such as Cadence Allegro;

3. Familiar with semiconductor design and PCB design;

4. Good communication skills, problem analysis skills, strong coordination skills, and a sense of teamwork;

5. Strong quality awareness, sense of responsibility and self-motivated;

6. Familiar with and understand the principle of high-speed signal processing and wiring, as well as the priority of signal integrity;

7. Good English reading and writing skills.

Benefits:

Five social insurance and one housing fund and supplementary commercial insurance

Generous year-end bonus and project award

Paid annual leave and paid sick leave

The opportunity to adjust salary every year

Job Responsibilities:

1. Responsible for the daily maintenance of laboratory test instruments and systems;

2. Test the chip according to the test tasks developed by the research and development, including routine test, stability test, noise test, aging test, etc., and form the test report;

3. Set up a test platform according to test requirements, and debug and analyze abnormal situations in the test process;

4. Assisted in the introduction and debugging of chip mass production; went to the factory for system debugging and supervision according to the needs of the situation.

Job Requirements:

1. More than two years of working experience;

2. Bachelor degree or above, majored in electronic engineering;

3. Familiar with radio frequency communication principle, master the operation and principle of radio frequency test instruments, including signal source of KEYSIGHT, spectrum analyzer and network analyzer;

4. Have relevant working experience in chip testing;

5, have programming experience, familiar with LabVIEW/C/C++/.NET/Matlab and other program development languages.

Benefits:

Five social insurance and one housing fund and supplementary commercial insurance

Generous year-end bonus and project award

Paid annual leave and paid sick leave

The opportunity to adjust salary every year